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| Date: | Thu, 29 Sep 2005 14:54:09 -0500 |
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Hi George!
I work at a contract manufacturing company, and we see solder paste gerber
files provided in a few different ways, or sometimes not at all.
I sometimes get them with unique shapes that are different from the pad shape
on the board. For example I have seen the BGA openings in the solder paste
gerber using squares instead the actually shape of the pad on the board which
is a circle.
I have seen files provided to us as ODB++ files which some stencil vendors have
not yet used, and it will take them a bit to get the necessary software to use the file
so that they can produce a stencil.
Me, I just like a straight 1-to-1 gerber file of the solder paste layer that mirrors the
SMT pads and fiducials exactly.
Kind regards,
-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
"Kotecki, George" <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
09/29/2005 02:05 PM
Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to "Kotecki, George" <[log in to unmask]>
To: [log in to unmask]@SMTP@Exchange
cc: (bcc: Stephen R Gregory/LABARGE)
Subject: [TN] Assembly data requirements
To all:
What has been your experience regarding solder mask data supplied to
contract assemblers? Do they request or use customer supplied data or
do they prefer to generate their own stencils based on volumes? This is
just an informal poll. Thanks in advance
George Kotecki
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