I would not be surprised if the X ray does damage some
components depending on the intensity and the duration of the exposure.
Part of the process in building a chip or IC is ion implantation. A
material is doped positive or negative with respective ions, i.e. Ion
implanter. Layer thickness is getting smaller every year, in the
Angstroms, (1 micrometer = 10000 Angstroms = 0.001 millimeters =
0.0000394 inches ). The length of a transistor gate is 60 nanometers. I
have also heard not to take some sensitive electronic equipment through
X ray at the air ports due to the intensity of the exposure since
several years ago from people that work with me and take electronic
equipment all the time.
Does anyone know someone that can do that type of experimentation or
know someone that already have?
Ramon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Charles Caswell
Sent: Wednesday, September 28, 2005 8:39 AM
To: [log in to unmask]
Subject: Re: [TN] X-ray inspection, can it damage devices?
Steve, I have heard of X-Ray erasing some memory but not actually
damaging the component.
-----Original Message-----
From: Stephen R Gregory [mailto:[log in to unmask]]
Sent: Tuesday, 27 September 2005 1:43 PM
To: [log in to unmask]
Subject: Re: [TN] X-ray inspection, can it damage devices?
Hi Phil!
The BGA in question is a small one, only
100-balls, and a plastic part with no heat-sink.
It's on the bottomside of the board, and
has to go through reflow one more time when the
topside is built.
As I said, everything looks fine at
x-ray...it is inspected pretty closely too.
Our customer is the one who is worried
about x-ray, not us. They can't get the device to
accept a program on some boards, and
they are thinking that possibly x-ray damaged
the device.
Kind regards,
-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
Phillip Bavaro <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
09/27/2005 01:16 PM
Please respond to TechNet E-Mail Forum
<[log in to unmask]>; Please respond to Phillip Bavaro
<[log in to unmask]>
To: [log in to unmask]@SMTP@Exchange
cc: (bcc: Stephen R Gregory/LABARGE)
Subject: Re: [TN] X-ray inspection, can it damage
devices?
Hi Steve,
I haven't ever heard of or experienced
any
issues with an xray inspection system causing damage to a chip. It is
hard
to believe that xrays momentarily exposed to a chip could cause damage.
I have seen some Altera BGAs that have
difficulty getting good solder joint reflow due to the heatsinks on top
of them, the pwb's 24 layers, and the sheer number of solderballs
(1500+). With your .050" copper core, I would look at the thermal
reflow and make sure that all the balls on the BGAs have fully
collapsed.
Was this BGA on the second side or first
side reflowed?
It is tough sometimes to tell where the
problem is if you don't have a board level test in place.
Phil
Steve Gregory
<[log in to unmask]>
wrote:
Good Mornin' Everyone!
I hope you all had a good weekend! I
worked Saturday, but had
Sunday off. Sat around Sunday and
watched the NASCAR race
at the "Monster Mile" in Dover Delaware.
20-year old Kyle Busch
gave Jimmie Johnson a run for his money
finishing second at the
green/white/checkered ending....but I
digress.....
Anyways, we built an assembly here that
has a .050" copper core
in the center of it...not the same
assembly as the one I did my "okie
cross-section" on).
It is double-sided SMT, and has BGA's on
both sides. I'm doing x-ray
inspection with a Fein Focus Tiger 160,
and in order to penetrate the
core and do a proper inspection of the
solder joints and spheres of the
BGA's, the x-ray power is up around
120-130kv.
Our customer received a number of the
assemblies from us (without test
from us, as they are prototypes and test
hasn't been developed yet), and
they are having problems with one of the
BGA's.
It's a 100-ball Max-7000 device from
Altera, a CMOS EEPROM, and our
customer has been trying to program the
device via on-board programming,
but some boards wont program. The x-ray
inspection turned out fine. All
BGA's were inspected using oblique
angles, so if there was an open joint,
it would have been seen.
They are worried that maybe the x-rays
may have damaged the device.
Altera has told our customer that the
x-rays shouldn't hurt the device.
I've got
a case number started via email in to
Altera (since I can't talk to anyone
on
the phone), asking them myself if x-rays
will damage the device. I'm also
going to call Fein Focus and talk to
them as well.
But have any of you ever heard of x-ray
damaging BGA's?
Kind regards,
-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
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