Steve, I have heard of X-Ray erasing some memory but not actually damaging
the component.
-----Original Message-----
From: Stephen R Gregory [mailto:[log in to unmask]]
Sent: Tuesday, 27 September 2005 1:43 PM
To: [log in to unmask]
Subject: Re: [TN] X-ray inspection, can it damage devices?
Hi Phil!
The BGA in question is a small one, only
100-balls, and a plastic part with no heat-sink.
It's on the bottomside of the board, and has
to go through reflow one more time when the
topside is built.
As I said, everything looks fine at
x-ray...it is inspected pretty closely too.
Our customer is the one who is worried about
x-ray, not us. They can't get the device to
accept a program on some boards, and they are
thinking that possibly x-ray damaged
the device.
Kind regards,
-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
Phillip Bavaro <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
09/27/2005 01:16 PM
Please respond to TechNet E-Mail Forum
<[log in to unmask]>; Please respond to Phillip Bavaro <[log in to unmask]>
To: [log in to unmask]@SMTP@Exchange
cc: (bcc: Stephen R Gregory/LABARGE)
Subject: Re: [TN] X-ray inspection, can it damage devices?
Hi Steve,
I haven't ever heard of or experienced any
issues with an xray inspection system causing damage to a chip. It is hard
to believe that xrays momentarily exposed to a chip could cause damage.
I have seen some Altera BGAs that have
difficulty getting good solder joint reflow due to the heatsinks on top of
them, the pwb's 24 layers, and the sheer number of solderballs (1500+). With
your .050" copper core, I would look at the thermal reflow and make sure that
all the balls on the BGAs have fully collapsed.
Was this BGA on the second side or first side
reflowed?
It is tough sometimes to tell where the
problem is if you don't have a board level test in place.
Phil
Steve Gregory <[log in to unmask]>
wrote:
Good Mornin' Everyone!
I hope you all had a good weekend! I worked
Saturday, but had
Sunday off. Sat around Sunday and watched the
NASCAR race
at the "Monster Mile" in Dover Delaware.
20-year old Kyle Busch
gave Jimmie Johnson a run for his money
finishing second at the
green/white/checkered ending....but I
digress.....
Anyways, we built an assembly here that has a
.050" copper core
in the center of it...not the same assembly
as the one I did my "okie
cross-section" on).
It is double-sided SMT, and has BGA's on both
sides. I'm doing x-ray
inspection with a Fein Focus Tiger 160, and
in order to penetrate the
core and do a proper inspection of the solder
joints and spheres of the
BGA's, the x-ray power is up around
120-130kv.
Our customer received a number of the
assemblies from us (without test
from us, as they are prototypes and test
hasn't been developed yet), and
they are having problems with one of the
BGA's.
It's a 100-ball Max-7000 device from Altera,
a CMOS EEPROM, and our
customer has been trying to program the
device via on-board programming,
but some boards wont program. The x-ray
inspection turned out fine. All
BGA's were inspected using oblique angles, so
if there was an open joint,
it would have been seen.
They are worried that maybe the x-rays may
have damaged the device.
Altera has told our customer that the x-rays
shouldn't hurt the device.
I've got
a case number started via email in to Altera
(since I can't talk to anyone
on
the phone), asking them myself if x-rays will
damage the device. I'm also
going to call Fein Focus and talk to them as
well.
But have any of you ever heard of x-ray
damaging BGA's?
Kind regards,
-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
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