That's correct, it is between the traces, and they claim to remove the
bonding material being used to adhere the copper on to the substrate by
that way.
I do not understand what you mean for "low k"
Ivan
Il giorno 06/set/05, alle 16:32, Joyce Koo ha scritto:
> Jeff,
> sounds like the copper surface is not the problem but "between the
> trace" =
> FR4 or what ever... it is absorb the plating solution, that is why it
> can
> not obtain a good SIR value... something is porous and absorb the
> plating
> solution..or for what ever the reason can not be clean away easily
> (may be I
> read wrong...I will stay away any sponge like stuff.. may be low k or
> cute..).
> my 1.68 cents.
> jk
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Jeffrey Bush
> Sent: Tuesday, September 06, 2005 10:19 AM
> To: [log in to unmask]
> Subject: Re: [TN] Sand blasting pcb after copper etching
>
>
> This is not a normal process. I would think that chemical etching is
> more affective in removing metals and oxides from the resin surface.
> We
> see no issues with SIR/MIR using standard PCB processes. I have done
> this in the past of flex to promote stiffener bonding and mask
> adhesion.
> Possible the PCB house has an issue with chemical etching or base
> materials.
>
> Jeffrey Bush
> Director, Quality Assurance and Technical Support
>
> VERMONT CIRCUITS INCORPORATED
> 76 Technology Drive - POB 1890
> Brattleboro, Vermont 05302
> Voice: 802.257.4571.21 Fax: 802.257.0011
> http://www.vtcircuits.com
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Ivanoe Pedruzzi
> Sent: Tuesday, September 06, 2005 9:35 AM
> To: [log in to unmask]
> Subject: [TN] Sand blasting pcb after copper etching
>
> Dear Technetters,
>
> I'm not familiar with the process of making pcb and I would like to
> have your comments on something I was told from a pcb maker
> representative.
>
> "...in order to ensure a well insulation between traces, we do
> sandblasting (very little and tiny) pcb's after etching.
> this is to remove the bonding material that remains on the board after
> removing the copper. This is the only way to achieve a very good SIR
> result."
>
> Is this a normal procedure, was he correct in his claim?
>
>
> Thanks,
> Ivanoe Pedruzzi
>
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