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September 2005

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Subject:
From:
Dave Simonik <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 23 Sep 2005 15:06:15 -0400
Content-Type:
text/plain
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text/plain (135 lines)
Bob;

  Is this bonding per customer design? There's nothing worse than having to
pry / rip / pull / de-bond a cover on something to gain access to something
that needs replacement, fixing, or tuning. Especially with aluminum, you end
up with a twisted / distorted cover that you now need to take a hammer to,
to straighten out. I would recommend drilled & tapped holes to use some
small machine screws with. And don't forget the gasket.

Dave Simonik
Process Tech.
Sanmina SCI
Owego NY Division

-----Original Message-----
From: Bob Arciolla [mailto:[log in to unmask]]
Sent: Friday, September 23, 2005 2:52 PM
To: [log in to unmask]
Subject: Re: bonding material


Hi Mike,

Thank you for the input, I am looking to dispense from a EFD dispenser, so
one part preferred. The main reason for bonding is to secure the cover to
the case, but still give the customer access to the unit if necessary. It is
a epoxy cured inverter and the casing is more for RF protection.

Thanks  Bob
----- Original Message -----
From: "Barmuta, Mike" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, September 23, 2005 2:28 PM
Subject: Re: [TN] bonding material


> Bob: In general I would recommend two part epoxy designed for metal
bonding.
> Loctite/Hysol's E-20NS is an example. There are many others available.
> However you do not provide much detail as to the required cured
> properties and environmental exposure. More information could dictate
> a different adhesive type.
>
>
> Regards
>
> Michael Barmuta
>
> Staff Engineer
>
> Fluke Corp.
>
> Everett WA
>
> 425-446-6076
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Bob Arciolla
> Sent: Friday, September 23, 2005 11:09 AM
> To: [log in to unmask]
> Subject: [TN] bonding material
>
>
> Hi all,
>
> I have a unit that we manufacture that has a aluminum case and cover
> and
was
> wondering if anyone can recommend a bonding material for this and
> where to get it. Thanks in advance,
> Bob Arciolla
> Endicott Research Group
>
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