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September 2005

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Subject:
From:
Ivanoe Pedruzzi <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ivanoe Pedruzzi <[log in to unmask]>
Date:
Tue, 6 Sep 2005 15:34:48 +0200
Content-Type:
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text/plain (28 lines)
Dear Technetters,

I'm not familiar with the process of making pcb and I would like to
have your comments on something I was told from a pcb maker
representative.

"...in order to ensure a well insulation between traces, we do
sandblasting (very little and tiny) pcb's after etching.
this is to remove the bonding material that remains on the board after
removing the copper. This is the only way to achieve a very good SIR
result."

Is this a normal procedure, was he correct in his claim?


Thanks,
Ivanoe Pedruzzi

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