Hello Everyone,
I have a question which I am hoping someone can help me with. I am getting
conflicting information on what to do about the impending lead free
compliancy and footprint creation. I was originally told both on another
forum and through other lines of questioning that the new lead free parts
would not affect the way I build my footprints and to go ahead and continue
using the same land patterns for both ROHS compliant and non-compliant
parts. I was informed the other day however that due to the need to reduce
the number of heat cycles that BGA's see when reballed for lead free that
BGA's are now going to be created without balls and I will need to change my
land patterns for those at the least and that I should look into the
possibility of the need to change them for other parts as well. As most of
you are currently discovering the wonderful side effects of the new
processes, I figured this would be the best place to get "straightened
out"..... Do I need to make footprints for lead free parts differently than
for leaded parts? And if so, Is it only BGA's I need to worry about or other
types of parts as well? 
Thanks in advance,
Dharma

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