Hi All,

There is a great paper by Bob Willis on fillet lifting.  Check out his website: www.leadfreesoldering.com.  

Regards,
Helena Pasquito  

 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Roland Dollinger
Sent: Friday, September 23, 2005 5:39 AM
To: [log in to unmask]
Subject: [TN] lead free soldering "fillet lifting"

Dear all,

who has detailed info for me about lead free soldering due to "fillet lifting"

What is the root cause of fillet lifting?
- Low cooling rate after soldering?
- contamination of Bi?
- contamination of Pb?
- amount of latent heat released during solidification?
- Does fillet lifting not occurs, when the FRI (fillet-lifting resistant
index) is bigger than 0,75?

How can we avoid fillet lifting?

Has anybody read the US patent US6617529A1_anti solder fillet lifting?
This patent recommend a pad width bigger than 0,4mm to avoid fillet lifting. Does everybody know, what this patent will mean for us?
I read the old aged MIL-STD-275E and in my opinion I´m convinced, that due to this MIL standard the US-patent US6617529A1is covered too.
What do you think about this?

Thank you for your comments.

Roland Dollinger
Valeo
Process Engineer
Valeostraße 1
86650 Wemding
Germany

[log in to unmask]


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Search the archives of previous posts at: http://listserv.ipc.org/archives
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