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September 2005

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From:
Dennis Becker <[log in to unmask]>
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Date:
Fri, 23 Sep 2005 09:18:31 -0500
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I tried to attach an IPC Bi presentation given by Dr.Jenny Hwang.But the
attachement appears to have been removed from the email.i suppose it's
not allowed....
Anyway,I am not an expert,but it appears ternary pase has only been
shown to occur when the Bi percentage is really high:16Sn32Pb52Bi.

It also adresses fillet lifting.Perhaps some more knowlegable than I
am,is familiar with the material and can summarize or share it with
you.Regards

Dennis



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dennis Becker
Sent: Friday, September 23, 2005 7:43 AM
To: [log in to unmask]
Subject: Re: [TN] lead free soldering "fillet lifting"


FYI

Dennis Becker



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Friday, September 23, 2005 5:19 AM
To: [log in to unmask]
Subject: Re: [TN] lead free soldering "fillet lifting"


Lieber Roland,
Filet lifting is the result of having a Bi-containing solder and 
contaminating Pb forming a low-melt-temperature ternary phase with Sn
which has a Tm=96C. 
Making the fillet bigger will not solve this problem.

Viel Glück an Deiner Arbeit mit diesem blei-freien Schildbürgerstreich,
Werner Engelmaier Engelmaier Associates, L.C. Electronic Packaging,
Interconnection and Reliability Consulting 7 Jasmine Run Ormond Beach,
FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com


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847-615-7100 ext.2815
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