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From:
"Schaefer, Chris" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Schaefer, Chris
Date:
Thu, 22 Sep 2005 11:07:53 -0500
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Thank Phillip, I appreciate it.

Does anyone else have any thoughts on this? I would like additional feedback if possible.

Thank You in advance...

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Phillip Bavaro
Sent: Wednesday, September 21, 2005 4:02 PM
To: [log in to unmask]
Subject: Re: [TN] Lead Free pastes, wave solder, and core solders


Hi Chris,

I agree with Bev, but wanted to add that the wavesolder solder alloy has to deal with the variability of the percentages of it's components and the make up bar solder may be lacking the copper or silver constituent depending on the analysis of the pot and the finishes used on the product being put through it.  Again this is half blind information and not based upon years of experience as no one is an expert in Pb free yet.

Hope this helps

Phil


Chris Schaefer <[log in to unmask]> wrote:
Hello all,

I have a few question concerning the types of alloys used for pastes, wave
solders, and core wire solders used in Lead Free processes.

All of your help would be much appreciated...
>>>>>>>>>>>>>
I understand that SAC 305 is considered to be the industry standard and
there has been much testing to indicate that it performs well in all of the
mentioned processes stated above. Of course there are other solder
compositions that are available to be used in these applications such as
SAC 359, SAC 387, SAC 396, and SN100C. In terms of the testing of
alternative compositions there is a measured amount of testing involved
with them as well - some favoring better in some areas than others.

The questions are:

- Is SAC 305 truly the safest bet for soldering in these process arena's?
- Must you use the same solder composition for the smt, wave solder, and
core wire soldering area's? I understand that when one type is used in wave
soldering and a different type used in the touch-up of the assemblies that
the composition will change, but does that make a significant difference.
Possibly in the realm of the Materials Declaration process it may
perhaps???? Don't know...
- Are there in your opinions better alloys than SAC 305 no matter the cost?
- Are any of you using other allow compositions (non SAC 305) in smt, wave
solder, and core solders? If so what drove you to use other compositions?
Costs, larger process windows, better joint cohesion, etc... And what are
you thoughts on using them?
- I heard in these rooms and others that the more silver content in the
composition the better in terms of solderability. Is this true in the Pb
Free arena as well?

>>>>>>>>>>>>>
We are currently in the process of setting up a Pb Free process for these
core processes and I am not completely convinced that SAC 305 is the right
choice for wave solder, it may be a good choice, but is it the absolute
best choice. Especially knowing that new allows are coming out all of the
time and possibly better ones for the stated processes. I don't claim to be
anything close to an expert in terms of Pb Free soldering or even
metallurgy compositions, but I certainly would like to know that whatever
choice is made - it is the best choice for us right now.

I would appreciate your help in this matter. You help is much appreciated
as always.

Thank You.

Chris Schaefer
Suntron Corporation
Process Engineer
540 N. Rogers Road
Olathe, Kansas 66062
913.393.5878
[log in to unmask]

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