Me too! Take me off the list. Gerard is trying to interrupt our
frivolity with serious technical input. I feel better already. There is
something to be said about being listless for a change.
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Thursday, September 22, 2005 5:34 AM
To: [log in to unmask]
Subject: Re: [TN] ENIG contaminant : Auger analysis recommended ? NTC
I'm jealous. :)
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gerard O'Brien
Sent: September 22, 2005 8:16 AM
To: [log in to unmask]
Subject: Re: [TN] ENIG contaminant : Auger analysis recommended ?
Michael - we have the luxury of owning an Auger as well as running high
volumes of ENIG through our plant. We purchased an Auger when we were
running 20,000 panels/week of electroless Pd as this tool is exactly
what you need for surface analysis. It will be of no use for determining
the presence of black nickel as the definition of "black nickel" has yet
to be accepted. Can it determine the amount of phos at the interface -
yes, can it determine the amount of phos in the bulk - absolutely, both
indicators of the quality of how the bath was controlled/maintained by
the board supplier, and something that is cited as indicative of the
presence of black nickel.
Can it pick up other contaminants like Cu, etc in the deposit - yes. It
will pick up Ni as you scan the Au surface. It can pick up residues
associated with solder mask or dry film residues. You may wish also to
expand it to use XPS and have them identify the relative oxidation
states of the elements found - can be more informative than just
identifying the presence of something - great for showing excessive
rinsing/hold times post Ni plating that passivates the surface impacts
solderability.
If you wish to contact me off line with specifics.
Regards
Gerard O'Brien
Photocircuits Corporation
Co-Chairman 4-14 plating committee.
-----Original Message-----
From: Arbour, Michel [mailto:[log in to unmask]]
Sent: Tuesday, September 20, 2005 4:12 PM
To: [log in to unmask]
Subject: [TN] ENIG contaminant : Auger analysis recommended ?
Hi
We will be sending non solderable PCB for analysis. Goal is to detect
black nickel, black pad, soldermask contamination before plating or
other contaminant. Is Auger analysis with ion sputtering (SAM) an
effective method to determine the contaminants. Is this method proven
and accepted in the PCB industry for this task ?
Michel Arbour
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