Don't count on it, Joe :-( EMPs are, on the whole, an ignorant bunch who
are there for the gravy train and they will do nothing that may prevent
re-election next time round. I came across an oxymoron in a doc I was
proof-reading yesterday: "good politicians"!
Joe Fjelstad wrote:
> This is not really new information to these forums but at least the business
> press is starting to wake up to the broader looming technical issues above the
> "green" marketing hype... Maybe the EU Parliament will someday do the same
> also... ;-)
>
> Best to all,
> Joe
>
>
> "Lead-free rules hit yields, European packagers, says analyst"
>
> Peter Clarke
> EE Times
> (09/21/2005 12:00 PM EDT)
>
>
> LONDON — European requirements for lead-free wafer bumping and packaging are
> hitting manufacturing yields and also hitting assembly companies in Europe as
> the far-east copes better with changes, according to research company Frost &
> Sullivan.
> As Europe has been the pioneer of lead regulation it is natural that the
> European electronic packaging industry leads the world in terms of research and
> development — backed by leading microelectronic research institutes such as
> Institut fur Zuverlassigkeit/Mikrointegration (IZM Fraunhofer). However, the Eu
> ropean industry is facing a problem of underfinancing and stiff competition from
> the Far East.
> “For instance, Netpack-Europe.org, the official organization for chip
> packaging manufacturers in the European Union, is likely to be closed during the year
> due to lack of financial support,” said Sivakumar Muthuramalingam, a Frost &
> Sullivan research analyst, in a statement. “To combat this issue, packaging
> service providers must develop and implement a fiercely aggressive market
> strategy with respect to price, customer service, quality and reliability,” he
> added.
> A range of websites previously operated by Netpack-Europe.org were
> unavailable when this story was first posted.
> Packaging companies are finding that in some cases the use of lead-free
> alternatives is causing a loss of yield, Frost & Sullivan said. Participants
> utilize lead-free alternatives such as tin-silver-copper (Sn-Ag-Cu), also called the
> SAC system, combined with materials such as gold. However, the slow adoption
> of these processes is due to issues such as high yield loss and low
> reliability.
> “For instance, flip-chip (FC) assembly qualifies for eutectic lead-tin, but
> proves to be difficult for lead-free material,” said Muthuramalingam. “High
> yield losses occur after the board assembly due to substrate warpage,” he added.
> “The integration of lead-free materials into flip-chip and chip scale package
> applications is difficult due to the material characteristics such as
> stiffness, and material compliance that increasingly makes reliability an issue. To
> overcome this, researchers in Germany are continuously working to develop novel
> wafer bumping technologies for a wide range of applications,” said
> Muthuramalingam.
> Although Europe has largely set the agenda around environmental issues with
> European Union's Restriction of the Use of Hazardous Substances' (ROHS)
> directive Southeast Asian packaging industry participants are intensifying
> competition as the packaging service providers in Europe are unable to continue to drive
> down prices, Frost & Sullivan said
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
> -----------------------------------------------------
>
--
______________________________________________
Please note new e-mail address [log in to unmask]
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
