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September 2005

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Subject:
From:
Mumtaz Bora <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Mumtaz Bora <[log in to unmask]>
Date:
Wed, 21 Sep 2005 16:48:04 -0700
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Thanks to Steven , Geoff , Guy  Dennis  Kathy, Richard, Phil , Jana and
Scott, for your valuable inputs for the PWB Delamination issue.  I have
evaluated the reworked boards thru 2 passes of reflow and do see some
bubbling. I have also subjected some reworked boards thru temp.humidity
testing and see some bubbling. We are conducting  X-sections to evaluate
this. Lot is rejected and waiting for replacement parts.
Thank-you

Mumtaz

  D/ 252 - SMT Process and Component Quality
  Bldg. V238E
Voice  (858)-882-1967
Fax    (858)-882-3126
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email: [log in to unmask]
Kyocera-Wireless Corp.
10300, Campus Point Drive
San Diego, Ca  92121,USA

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