Hi Lee,
Thank for your advise

MIchel


-----Original Message-----
From: Lee parker [mailto:[log in to unmask]]
Sent: Tuesday, September 20, 2005 10:31 PM
To: [log in to unmask]
Subject: Re: [TN] ENIG contaminant : Auger analysis recommended ?


Michel

Those who are familiar with Auger will tell you it is the method of choice
for surface analysis. It only penetrates angstroms into the surface and you
can sputter a controlled depth into the surface. The only issue I have ever
encountered is the operator; you need an expert to operate the machine and
interpret the results.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389
  ----- Original Message -----
  From: Arbour, Michel<mailto:[log in to unmask]>
  To: [log in to unmask]<mailto:[log in to unmask]>
  Sent: Tuesday, September 20, 2005 5:11 PM
  Subject: [TN] ENIG contaminant : Auger analysis recommended ?


  Hi
  We will be sending non solderable PCB for analysis. Goal is to detect
black
  nickel, black pad, soldermask contamination before plating or other
  contaminant. Is Auger analysis with ion sputtering (SAM) an effective
method
  to determine the contaminants. Is this method proven and accepted in the
PCB
  industry for this task ?

  Michel Arbour

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