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September 2005

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Subject:
From:
"Smith, Richard" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Smith, Richard
Date:
Wed, 21 Sep 2005 07:34:45 -0400
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Folks,
 
Thank you all very much for your help, especially Royce T, Happy H , Richard S, Kat K, Ofer C, Paul E, Ioan T and Dwight M ! Below is a summary of the responses I received.
 
Certainly feasible and in fact is a relatively common practice.
There are companies that produce adapters for similar applications and others that will supply a finished product to your specifications.  
 
If you design the card yourself:
Use high temperature substrate.
The BGA sphere pattern can also be purchased in pretty much any configuration.
Individual high temperature solder spheres can be purchased (in low volume if desired) and applied to the BGA land pattern with solder paste and reflowed. Then the top side components would be assembled and flowed.
Assuming the geometry of the board is within the constraints of the assembly equipment it can be pick & placed.
 
 
Original inquiry:
We have a requirement to design a daughterboard that will be soldered to the motherboard in place of BGA devices. This means that BGA balls are required (on the secondary side) of the daughterboard so it can be soldered to the existing BGA pattern(s) on the motherboard, as if it were just another BGA. I've not heard of this being done before so I'm hoping others may be able to provide some insight in regards to feasability and process.

Thanks All!
Rick

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