Michel

Those who are familiar with Auger will tell you it is the method of choice for surface analysis. It only penetrates angstroms into the surface and you can sputter a controlled depth into the surface. The only issue I have ever encountered is the operator; you need an expert to operate the machine and interpret the results.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389 
  ----- Original Message ----- 
  From: Arbour, Michel<mailto:[log in to unmask]> 
  To: [log in to unmask]<mailto:[log in to unmask]> 
  Sent: Tuesday, September 20, 2005 5:11 PM
  Subject: [TN] ENIG contaminant : Auger analysis recommended ?


  Hi
  We will be sending non solderable PCB for analysis. Goal is to detect black
  nickel, black pad, soldermask contamination before plating or other
  contaminant. Is Auger analysis with ion sputtering (SAM) an effective method
  to determine the contaminants. Is this method proven and accepted in the PCB
  industry for this task ?

  Michel Arbour

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