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Subject:	ENIG contaminant : Auger analysis recommended ?
From:	"Arbour, Michel" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Arbour, Michel
Date:	Tue, 20 Sep 2005 17:11:47 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (19 lines)

Hi
We will be sending non solderable PCB for analysis. Goal is to detect black
nickel, black pad, soldermask contamination before plating or other
contaminant. Is Auger analysis with ion sputtering (SAM) an effective method
to determine the contaminants. Is this method proven and accepted in the PCB
industry for this task ?

Michel Arbour

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