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September 2005

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Subject:
From:
"Tempea, Ioan" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tempea, Ioan
Date:
Tue, 20 Sep 2005 12:32:28 -0400
Content-Type:
text/plain
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text/plain (82 lines)
Paul,

try www.isipkg.com

Ioan

> -----Original Message-----
> From: TechNet [SMTP:[log in to unmask]] On Behalf Of Paul Edwards
> Sent: Tuesday, September 20, 2005 12:29 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] BGA Adpater board
> 
> Check with adapters.com..
> 
> Paul Edwards
> Process Engineering
> [log in to unmask]
> Tel: 408-433-4700
> FAX: 408-433-9988
> Surface Art Engineering
> 81Bonaventura Dr.
> San Jose, CA 95134
> DUNS: 944740570
> CAGE/NCAGE: 1XZ48
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Smith, Richard
> Sent: Tuesday, September 20, 2005 4:11 AM
> To: [log in to unmask]
> Subject: [TN] BGA Adpater board
> 
> Folks,
> 
> We have a requirement to design a daughterboard that will be soldered to
> the motherboard in place of BGA devices. This means that BGA balls are
> required (on the secondary side) of the daughterboard so it can be
> soldered to the existing BGA pattern(s) on the motherboard, as if it
> were just another BGA. I've not heard of this being done before so I'm
> hoping others may be able to provide some insight in regards to
> feasability and process.
> 
> Thanks Much!
> 
> Rick
> 
> 
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