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September 2005

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Subject:
From:
Ofer Cohen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ofer Cohen <[log in to unmask]>
Date:
Tue, 20 Sep 2005 17:14:13 +0200
Content-Type:
text/plain
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text/plain (55 lines)
Rick,
We have done it in the past as an adaptor for a test connector, that was mounted on the connections of a BGA. This is exactly as you said. The adsoldering of the balls to the daughter board was done in reballing station. We experience no problems.

Ofer Cohen
Manager, Quality, Reliability and Production Technologies
Seabridge -a Siemens company

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Smith, Richard
> Sent: Tuesday, September 20, 2005 13:11
> To: [log in to unmask]
> Subject: [TN] BGA Adpater board
> 
> Folks,
> 
> We have a requirement to design a daughterboard that will be 
> soldered to the motherboard in place of BGA devices. This 
> means that BGA balls are required (on the secondary side) of 
> the daughterboard so it can be soldered to the existing BGA 
> pattern(s) on the motherboard, as if it were just another 
> BGA. I've not heard of this being done before so I'm hoping 
> others may be able to provide some insight in regards to 
> feasability and process.
> 
> Thanks Much!
> 
> Rick
> 
> 
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