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Subject:	Re: Fused tin lead plating versus HASL
From:	"Stadem, Richard" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard
Date:	Tue, 20 Sep 2005 08:35:22 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (45 lines)

Thank you, Werner. And you too, Steve/Stephen Gregory/Zeva.
Thank you very much. I now understand the difference. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Tuesday, September 20, 2005 8:27 AM
To: [log in to unmask]
Subject: Re: [TN] Fused tin lead plating versus HASL

Hi Richard,
Tin-lead plating is appied to a PWB as an etch resist. However, it is
co-plated tin and lead, not solder, and thus does not provide a
protection for the underlying copper. Therefore it needs to be
heated--fused, to make solder out of it, but in this process forms a
miniscus, not a very flat. Thus, it needs to be hot-air-solder-levelled,
which means excess liquid solder is simply blown off the surface
creating a much flatter surface.



Werner

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