Hi, folks
I have a pwb fab drawing that calls out fused tin-lead plating or solder
coating. I know that the solder coating is HASL, but what is fused
tin/lead? My understanding is that it is a tin/lead coating that is
applied to the bare pwb using a reflow oven process. Does this provide a
flat surface of tin/lead? If my only choice of finish is tin/lead, which
process is better in terms of flatness and solderability? I have a
fine-pitch BGA that is going to be assembled on this pwb.

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