 
| Subject: | |
| From: | |
| Reply To: | |
| Date: | Tue, 20 Sep 2005 06:33:27 -0500 |
| Content-Type: | text/plain |
| Parts/Attachments: |
|
|
Did this for a customer years ago at Hadco (Remember it Carrie??)
it was a 352 ball BGA land pattern (on the bottom) with a smaller BGA and chip resistors/capacitors mounted on the top side. If I remember correctly we attached the solder spheres 1st by printing paste with one stencil and then using another stencil, placed the solder spheres (apertures were big enough for the solder spheres to fall through). After reflow & wash we built the top side of the board (in carrier fixtures). When we mounted to the main PCB we were able to pick it out of a matrix tray and place it during our normal process.
I can take pictures and post them if you want an idea of what it looks like
Royce
*************************************************************************
Royce Taylor
Process Engineering/Production
Suntron Corporation NEO
104 Glenn Street
Lawrence, MA 01843
(978)747-2061 voice
(978)747-2010 fax
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Smith, Richard
Sent: Tuesday, September 20, 2005 7:11 AM
To: [log in to unmask]
Subject: [TN] BGA Adpater board
Folks,
We have a requirement to design a daughterboard that will be soldered to the motherboard in place of BGA devices. This means that BGA balls are required (on the secondary side) of the daughterboard so it can be soldered to the existing BGA pattern(s) on the motherboard, as if it were just another BGA. I've not heard of this being done before so I'm hoping others may be able to provide some insight in regards to feasability and process.
Thanks Much!
Rick
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|
