The formula you need is not solder volume. You need to know the solderable
surface area of the leads or lands and the weight of the part. Then search
the archives for "bottom side reflow". The formula has been posted many
times. It is a conservative rule of thumb. It may not be correct for Pb-Free
alloys. As I recall it was something like 4 gr.. per cm2 of lead or land
surface. But, look it up to be sure. Check postings between 2000 and 2004.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Rosen D.
Arabadzhiev</br>-----------------------------</br>
Sent: Thursday, September 01, 2005 4:19 AM
To: [log in to unmask]
Subject: [TN] necessary solder paste volume


Good day all,

Is there anybody who knows how can I calculate the necessary
solder paste volume, which will hold QFPs and BGAs over
bottom side of PCB during secondary side reflow process?

-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------