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| Date: | Fri, 16 Sep 2005 08:03:10 -0400 |
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The dielectric appears to be weak from 1-2 and 5-6. Possible the
b-stage layers are inadequate to sill the BV's and provide sufficient
bond-strength for the external layers. I would let you supplier own the
rework and they can certify the parts delivered to you. Does not appear
to be a cure issue as the BV filling look robust.
Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302
Voice: 802.257.4571.21 Fax: 802.257.0011
http://www.vtcircuits.com
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mumtaz Bora
Sent: Thursday, September 15, 2005 9:21 PM
To: [log in to unmask]
Subject: [TN] Rework for Delaminated PWBs
Dear Technetters,
We have received a large batch of PWBs that is showing delamination
after
reflow at peak temp. 230C. Laminate is high Tg - 170C.
Supplier is proposing to perform the following rework -- on these boards
instead of providing replacement parts.
Oven bake at 190C for 2.5 hours followed by second bake at 150C for 2
hours at 6kg/cm2 pressure. Will this guarantee a full cure?
I am concerned about latent failures and layers opening up as full cure
was
not achieved the first time.
Any inputs from the forum will be appreciated.
I will request Steven Gregory to place the image of delamination on his
website. Have a great weekend.
Thank-you
Mumtaz
D/ 252 - SMT Process and Component Quality
Bldg. V238E
Voice (858)-882-1967
Fax (858)-882-3126
Page (858)-635-1180
Cell: (858) -449-7054
email: [log in to unmask]
Kyocera-Wireless Corp.
10300, Campus Point Drive
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