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September 2005

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Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jeffrey Bush <[log in to unmask]>
Date:
Wed, 14 Sep 2005 11:43:14 -0400
Content-Type:
text/plain
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text/plain (180 lines)
If you have a good solder connection the bumps will not affect the
function - in fact you likely have better adhesion of the devices with
more surface area.  

Jeffrey Bush
Director, Quality Assurance and Technical Support

VERMONT CIRCUITS INCORPORATED
  76 Technology Drive - POB 1890
    Brattleboro, Vermont 05302
      Voice: 802.257.4571.21 Fax: 802.257.0011
           http://www.vtcircuits.com
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Wednesday, September 14, 2005 10:57 AM
To: [log in to unmask]
Subject: Re: [TN] [OT]...sorta RE: [TN] raised vias...I did a "Okie"
cross-section

You're right Dewey. Geeze, always correcting me...

I shoulda' said; I did a "Okie-dokie" Okie cross-section, huh?

Speaking of which, I went back it at again this morning for a bit.
Went deeper and deeper, and the width of the hole in the via did
not change much, which tells me that I was pretty much in the center
of the via....and as was commented earlier, they did a heck of a job
plating the walls of the vias...that's some thick walls of copper.

I got to a point where I could start seeing the back wall of the hole,
because some of the resin was coming out of the hole from the gentle
scraping I was doing with the exacto knife, and yes, now I believe that
is
pre-preg resin coming up through the blind via hole during lamination to
the thick copper core.

You can see my latest image at:

http://www.stevezeva.homestead.com/files/Cross_Section.jpg

This is a image that was taken from our SmartScope Flash system
at somewhere around 200 magnification.

Now comes the big question, are the bumps a reliability issue? I did see
some open/insufficient solder defects in the first build of these
boards.
We
touched things up for the most part, before I knew what was causing the
defects.
I can compensate for the insufficient  solder problems probably by
getting
a
thicker stencil, so should I worry about these bumps?

-Steve-



|---------+------------------------------->
|         |           "Whittaker, Dewey   |
|         |           (AZ75)"             |
|         |           <Dewey.Whittaker@HON|
|         |           EYWELL.COM>         |
|         |           Sent by: TechNet    |
|         |           <[log in to unmask]>   |
|         |                               |
|         |                               |
|         |           09/14/2005 08:38 AM |
|         |           Please respond to   |
|         |           TechNet E-Mail Forum|
|         |           <[log in to unmask]>;  |
|         |           Please respond to   |
|         |           "Whittaker, Dewey   |
|         |           (AZ75)"             |
|         |           <Dewey.Whittaker@HON|
|         |           EYWELL.COM>         |
|         |                               |
|---------+------------------------------->
 
>-----------------------------------------------------------------------
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  |
|
  |       To:       [log in to unmask]@SMTP@Exchange
|
  |       cc:       (bcc: Stephen R Gregory/LABARGE)
|
  |       Subject:  Re: [TN] [OT] RE: [TN] raised vias...I did a "Okie"
cross-section                            |
 
>-----------------------------------------------------------------------
---------------------------------------|



I is a half-way measure. Doakie completes the affirmation.
Dewey

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Craig Cullum
Sent: Wednesday, September 14, 2005 5:55 AM
To: [log in to unmask]
Subject: [TN] [OT] RE: [TN] raised vias...I did a "Okie" cross-section

OK, could someone explain to me what "Okie" means please?

TIA

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