We are trying to help a customer resolve a solderability problem they are
seeing on some boards they have received from an off-shore vendor.  Prior to
recent batches approx 8-10k boards have been received and assembled without
incident from the same vendor.  As a fabricator ourselves we have seen very
little in the way of solderability issues (knock-on-wood) with our ENIG so I
am not sure what steps we should take next.



We have received 4 panels for troubleshooting each with 4 images per.  Two
panels exhibit good solderability and two do not.  We have measured Au and
Ni using XRF on all panels and results for Ni are in the 200u" range with
gold being just under 2u".  I have cc'd Steve on this posting with attached
pictures in hopes that he can post them.  Should the boards be sent out for
surface analysis?  If so, which labs do such work?  A recent thread
mentioned EDS results are not always sufficient and that ToFSIMS is the way
to go.  Any insight as to which direction should be taken would be
appreciated.



Regards,

John Parsons




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