hi,
this may sound far out, but isn't possible that the people that designed
this board purposely have bumps to allow components to sit up off the
board. this might be done to facilitate cleaning underneath the parts
or to improve the durability of the solder joints.
phil
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Tuesday, September 13, 2005 2:44 PM
To: [log in to unmask]
Subject: Re: [TN] raised vias...I did a "Okie" cross-section
Hi All!
I have a local shop here do a lot of cross-sections for us, but I
couldn't take the board over to them until tommorrow. But I was so
curious to take a look at the bumps, or "raised vias", I decided to do
what I could, to see what I could.
We're not set-up to do cross-sections here (that may change in the
future), but I took a dremel tool and got close to where I wanted to
look, then started using finer and finer grit wheels. Then I used an
exacto knife and carefully scraped material away until I was able to see
how things looked at the raised vias. This was done under a microscope,
and I mean it was done carefully.
I know it's not as good looking as what a real cross section would look
like, but it does give an idea of how things look. Go to:
http://www.stevezeva.homestead.com and look at "Okie Cross-section".
I still don't know why I have the bumps...they look like they're solid
copper.
Kind regards,
-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
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