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September 2005

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Subject:
From:
"Brooks,Bill" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Brooks,Bill
Date:
Mon, 12 Sep 2005 15:45:47 -0700
Content-Type:
text/plain
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text/plain (127 lines)
I'm just passing the message on... it's Steve's board...

Thanks,

Bill Brooks

-----Original Message-----
From: Wenger, George M. [mailto:[log in to unmask]]
Sent: Monday, September 12, 2005 3:13 PM
To: TechNet E-Mail Forum; Brooks,Bill
Subject: RE: [TN] raised vias...

Bill,

It would be much easier to give you an informed answer if you could
provide a cross section of the via.  Right now any answer would simply
be a guess.  Are they blind vias?  Are they filled through vias?  Is the
photograph of an "as-received" PCB or is it after reflow?  If after
reflow was it a standard reflow or Pb-Free reflow?  Are the boards FR4,
Getek, Teflon? How thick?  How many layer?, etc.

Regards,
George
George M. Wenger, Andrew Corporation
Reliability / FMA Engineer
Base Station & Subsystems Group
40 Technology Drive, Warren, NJ 07059
(908) 546-4531 [log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brooks,Bill
Sent: Monday, September 12, 2005 5:54 PM
To: [log in to unmask]
Subject: [TN] raised vias...

Can someone give us a read on what they think cause the raised vias on
Steve's website picture? http://www.stevezeva.homestead.com  page 2.


Bill Brooks - KG6VVP
PCB Design Engineer, C.I.D.+, C.I.I.
Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510
Datron World Communications, Inc.
_______________________________________
San Diego Chapter of the IPC Designers Council
Communications Officer, Web Manager
http://dcchapters.ipc.org/SanDiego/
http://pcbwizards.com

-----Original Message-----
From: Steve Gregory [mailto:[log in to unmask]]
Sent: Monday, September 12, 2005 2:28 PM
To: [log in to unmask]
Subject: Re: [DC] Raised vias

Hi Fred and Everybody!

Speaking of "Raised Vias" and "Anthills", I have some anthills on some
Boards that we're building here now.

The anthills aren't from plugging or anything, but are blind via in pad.

I thought that they wouldn't present too much of a problem because I
thought that after printing paste and reflow, everything would level
out...but that wasn't the case.

At locations where I was placing something called a PowerPAK SO8, there
was
open solder defects at some of the joints because (I think) of the
raised
vias. You can see the PowerPAK part drawing, and the raised vias that
I'm
talking about on my web page at: http://www.stevezeva.homestead.com . Go
to
"Picture Page 2" and look for "PowerPAK SO8 and Raised Vias".

I don't have a clue why the vias are raised like that...maybe that's a
question for the TechNet.

Kind regards,

-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX

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