The picture has confirmed my original thoughts, even with the
non-centered section. It's resin spew from the prepreg during the
bonding of the blind via layer, which wasn't ground back down to the
surface.
I hate to think of the assembly issues this would cause!
Colin McVean M.inst.CT
Production Manager
Artetch Circuits Limited
Main: 01903 725365
DD: 01903 712926
www.artetch.co.uk
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: 13 September 2005 22:44
To: [log in to unmask]
Subject: Re: [TN] raised vias...I did a "Okie" cross-section
Hi All!
I have a local shop here do a lot of cross-sections for us, but I
couldn't
take
the board over to them until tommorrow. But I was so curious to take a
look
at the bumps, or "raised vias", I decided to do what I could, to see
what I
could.
We're not set-up to do cross-sections here (that may change in the
future),
but I took a dremel tool and got close to where I wanted to look, then
started
using finer and finer grit wheels. Then I used an exacto knife and
carefully
scraped material away until I was able to see how things looked at the
raised vias. This was done under a microscope, and I mean it was done
carefully.
I know it's not as good looking as what a real cross section would look
like,
but it does give an idea of how things look. Go to:
http://www.stevezeva.homestead.com and look at "Okie Cross-section".
I still don't know why I have the bumps...they look like they're solid
copper.
Kind regards,
-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
__________________________________________________________________
This message may contain information that is privileged and confidential
to
LaBarge, Inc. It is for use only by the individual or entity named
above.
If you are not the intended recipient, you may not copy, use or deliver
this message to anyone. In such event, you should destroy the message
and
kindly notify the sender by reply e-mail.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
