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Subject:	Re: IPC's pull test, shear tests!
From:	"Stadem, Richard" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard
Date:	Mon, 26 Sep 2005 12:36:52 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (31 lines)

IPC/JEDEC-9704 "Printed Wiring Board Stain Gage Test Guideline" 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ahmet Ferit Coþan
Sent: Monday, September 26, 2005 11:50 AM
To: [log in to unmask]
Subject: [TN] IPC's pull test, shear tests!

May i kindly ask one issue that i need anyones help regarding to his/her experience in electronic card assembly. I wonder if there is any IPC standard explains pull tests, shear tests,or tensile strenght tests of assembled cards? If so, is there any revision regarding the RoHS transition?


I am waiting for your kind asistance and interpretation on this issue.

Best regards.

Ahmet.

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Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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