We did that awhile back because of a design layout issue on the PCB to the BGA. We had some problems with the FR4 material with high temps, the BGA was lead free so make sure the adapter board is thermally able to handle the process. We stenciled the adapter board, picked the BGA and placed it. Then we used the assembled adapter board and picked it for the PCA assembly. It worked well except for the lead free thermal gotcha at first.
Kat
>>> [log in to unmask] 9/20/2005 6:41:15 AM >>>
Royce,
Oops, forgot to add that pictures would be great if it's not too much trouble!
Thanks,
Rick
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Taylor, Royce
Sent: Tuesday, September 20, 2005 7:33 AM
To: [log in to unmask]
Subject: Re: [TN] BGA Adpater board
Did this for a customer years ago at Hadco (Remember it Carrie??)
it was a 352 ball BGA land pattern (on the bottom) with a smaller BGA and chip resistors/capacitors mounted on the top side. If I remember correctly we attached the solder spheres 1st by printing paste with one stencil and then using another stencil, placed the solder spheres (apertures were big enough for the solder spheres to fall through). After reflow & wash we built the top side of the board (in carrier fixtures). When we mounted to the main PCB we were able to pick it out of a matrix tray and place it during our normal process.
I can take pictures and post them if you want an idea of what it looks like
Royce
*************************************************************************
Royce Taylor
Process Engineering/Production
Suntron Corporation NEO
104 Glenn Street
Lawrence, MA 01843
(978)747-2061 voice
(978)747-2010 fax
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Smith, Richard
Sent: Tuesday, September 20, 2005 7:11 AM
To: [log in to unmask]
Subject: [TN] BGA Adpater board
Folks,
We have a requirement to design a daughterboard that will be soldered to the motherboard in place of BGA devices. This means that BGA balls are required (on the secondary side) of the daughterboard so it can be soldered to the existing BGA pattern(s) on the motherboard, as if it were just another BGA. I've not heard of this being done before so I'm hoping others may be able to provide some insight in regards to feasability and process.
Thanks Much!
Rick
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