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Subject:	Water Analyse
From:	Baski Devre <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Baski Devre <[log in to unmask]>
Date:	Tue, 20 Sep 2005 08:44:20 +0300
Content-Type:	text/plain
Parts/Attachments:	text/plain (44 lines)

Dear Technetters
        As you know that there are lots of surface treatment before printing solder
mask. For the single side and double side PCBs inherint process copper sides
of the PCBs are subjected to etching and precleaned before printing
soldermask with water. So there may occur some smear problem after printing
soldermask. We would like to know that if there are any water parameters
used to clean pcbs before solder mask printing. I have reached some
information. There may occur some deposits on pcb which may cause smear or
CaCO3 due to water hardness. Or conductivity of the water is also important
which cause copper to combine with nitrate, sulfate, carbonate or
bicarbonate.Also Ph of the water is also important. But we do not have any
scientific value to compare our analysed results with any standard value.
So if any one have any information about the parameters of the water used in
PCB preclean process can she or he kindly share these values with us?

Best Regards



Yusuf GÖMEÇ
Product Quality Engineer

BASKI DEVRE SAN ve TIC LTD STI
Ceyhan Sk. No:10 34896 Pendik-Istanbul-Turkey

Tel: 00 90 216 3901036 (4 Hat/Line)-173(Extention)
     00 90 216 4836560 (4 Hat/Line)-173(Extention)
Fax: 00 90 216 3544941
     00 90 216 4913269
Gsm: 00 90 533 6579897
     00 90 533 7480014

Internet: www.baskidevre.com.tr

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