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September 2005

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Subject:
From:
Martin Cook <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Mon, 26 Sep 2005 09:26:58 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (68 lines)
Werner/MA/NY DDave

Not drawing conclusions on reliability, just offering observations on print
mis-positioning of paste that MA/NY DDave asked for comments on.

MA/NY DDave

Yes SIR testing in progress.

Best Regs
Martin

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
Sent: 23 September 2005 19:15
To: [log in to unmask]
Subject: Re: [LF] Print Mis-Positioning of Paste and Reflow Results


Martin,
Be careful about drawing conclusions about product reliability based on
accelerated test results--we do not have the needed acceleratin
mosels/factors for
LF-solders.



Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com


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