So we see the waves.
A while ago Guenther Grossman was complaining about the underfunding of his institute, so the whole thing must be real.
However, for now, there seem to be still the Europeans or North Americans leading the research. Are there any developments coming from the Far-east? Will they be able to increase the yields of flip-chips?
Honestly, I see the whole thing as a hurdle in the development of new technologies, as we will linger for a while figuring out how to solder what we used to, instead of soldering something new.
Just a thought.
Regards,
Ioan
> -----Original Message-----
> From: Leadfree [SMTP:[log in to unmask]] On Behalf Of Joe Fjelstad
> Sent: Wednesday, September 21, 2005 1:54 PM
> To: [log in to unmask]
> Subject: [LF] FYI ... Lead-free rules hit yields, European packagers, says analyst
>
> This is not really new information to these forums but at least the business
> press is starting to wake up to the broader looming technical issues above the
> "green" marketing hype... Maybe the EU Parliament will someday do the same
> also... ;-)
>
> Best to all,
> Joe
>
>
> "Lead-free rules hit yields, European packagers, says analyst"
>
> Peter Clarke
> EE Times
> (09/21/2005 12:00 PM EDT)
>
>
> LONDON > -> European requirements for lead-free wafer bumping and packaging are
> hitting manufacturing yields and also hitting assembly companies in Europe as
> the far-east copes better with changes, according to research company Frost &
> Sullivan.
> As Europe has been the pioneer of lead regulation it is natural that the
> European electronic packaging industry leads the world in terms of research and
> development > -> backed by leading microelectronic research institutes such as
> Institut fur Zuverlassigkeit/Mikrointegration (IZM Fraunhofer). However, the Eu
> ropean industry is facing a problem of underfinancing and stiff competition from
> the Far East.
> "> For instance, Netpack-Europe.org, the official organization for chip
> packaging manufacturers in the European Union, is likely to be closed during the year
> due to lack of financial support,> "> said Sivakumar Muthuramalingam, a Frost &
> Sullivan research analyst, in a statement. > "> To combat this issue, packaging
> service providers must develop and implement a fiercely aggressive market
> strategy with respect to price, customer service, quality and reliability,> "> he
> added.
> A range of websites previously operated by Netpack-Europe.org were
> unavailable when this story was first posted.
> Packaging companies are finding that in some cases the use of lead-free
> alternatives is causing a loss of yield, Frost & Sullivan said. Participants
> utilize lead-free alternatives such as tin-silver-copper (Sn-Ag-Cu), also called the
> SAC system, combined with materials such as gold. However, the slow adoption
> of these processes is due to issues such as high yield loss and low
> reliability.
> "> For instance, flip-chip (FC) assembly qualifies for eutectic lead-tin, but
> proves to be difficult for lead-free material,> "> said Muthuramalingam. > "> High
> yield losses occur after the board assembly due to substrate warpage,> "> he added.
> "> The integration of lead-free materials into flip-chip and chip scale package
> applications is difficult due to the material characteristics such as
> stiffness, and material compliance that increasingly makes reliability an issue. To
> overcome this, researchers in Germany are continuously working to develop novel
> wafer bumping technologies for a wide range of applications,> "> said
> Muthuramalingam.
> Although Europe has largely set the agenda around environmental issues with
> European Union's Restriction of the Use of Hazardous Substances' (ROHS)
> directive Southeast Asian packaging industry participants are intensifying
> competition as the packaging service providers in Europe are unable to continue to drive >
> down prices, Frost & Sullivan said
>
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