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September 2005

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Subject:
Re: Are different solder pots needed for using SnAgCu solder in solderability testing?
From:
"Smith, Rick" <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Thu, 29 Sep 2005 09:33:22 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (66 lines) 
You are probably looking at future maintenance and quality problems if
you don't verify compatibility and/or upgrade.

You should monitor solder purity closely, and could experience shortened
life of baffles, nozzles, impellers, screws, and any stainless
components.

Probably should get with your w/s equipment supplier (most can tell you
what is in your pot if you have the model# and S/N) and have your pot
checked for compatibility, the high tin content does tend to leach steel
and shorten life of components in most wave solder equipment, but also
if left un-checked it contaminates the solder in the pot. Re-fill of the
new solders is quite expensive due to the high silver content.
 
If your pot is deemed not compatible, upgrades w/Titanium are possible,
and expensive, (partial upgrade is not a good idea).

I'm guessing you are looking at 25,000 to 50,000. US $$ for upgrade of a
normal 1200 lb range solder pot, depending on who does the install.

asta  
    

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Romm, Doug
Sent: Thursday, September 29, 2005 8:50 AM
To: [log in to unmask]
Subject: [LF] Are different solder pots needed for using SnAgCu solder
in solderability testing?

For solderability testing: When replacing SnPb solder with SnAgCu solder
for solderability testing is a different pot required, possibly made of
a different material?  Or can the SnPb solder simply be replaced with
SnAgCu in the existing pot?

Any reference materials or papers on this topic would be appreciated.


Regards,

Doug Romm

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