This is one spooky thread. I know that NASA did some work on this subject,
but I left my references back at ACI. There was nothing in it suggesting
problems with X-ray inspection. They had some evidence that airport
inspection equipment might damage sensitive components.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Bev Christian
Sent: Wednesday, September 28, 2005 10:39 AM
To: [log in to unmask]
Subject: Re: [TN] X-ray inspection damaging components...
And what about the possibility of resulting intermittent failures?
Bev
RIM
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jason Gregory
Sent: September 28, 2005 10:34 AM
To: [log in to unmask]
Subject: Re: [TN] X-ray inspection damaging components...
Surely one could functionally test a known good part, then subject it to
incrementally increasing amounts of X-rays to eventually arrive a
failure
point, then log the results...but could such a test be deemed accurate?
I
would imagine that different components (same part number, package,
etc.)
would suffer different levels of failure, however slight or large.
Porbably is true that the component makers just want to be sure, so they
use
substantially lower numbers to ensure that their products are "safe" and
usable. But, at what point can the engineer, like Steve, say "130 kV is
too
much, but 90 kV is just fine". Just gambling.
Jason Gregory
Manufacturing Engineer
Innova Electronics
(281)653-5593
(281)653-5594 fax
(281)212-0844 cell
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Franklin Asbell
Sent: Wednesday, September 28, 2005 9:17 AM
To: [log in to unmask]
Subject: Re: [TN] X-ray inspection damaging components...
My first question at such a technical meeting would be
How much exposure will damage the part?
I'm sure if you place the part in the chamber, turn on the xray and go
to
lunch you might have some problems. But would seconds, cause damage?
What might be happening is component vendors want to protect their
product
and obviously so, so they place tighter than required standards on them,
what is the time to failure under 90kv at 20mA, and at 50mA, and at
90mA?
What is time to failure under 40kv at 90mA for 5 seconds? Or 30 seconds?
Just some things I would try to answer during such an IPC technical
activity.
Franklin
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard
Sent: Wednesday, September 28, 2005 9:01 AM
To: [log in to unmask]
Subject: Re: [TN] X-ray inspection damaging components...
Good Morning, Stephen!
This is good information. So now we have component vendors telling us
some of their components should not be overexposed to X-rays. Was there
any type of notation on the part print?
The industry needs a standard. We need to have some type of rating
system for components that can be damaged by X-rays.
Jack, is there any activity going on with this within IPC?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Wednesday, September 28, 2005 8:50 AM
To: [log in to unmask]
Subject: [TN] X-ray inspection damaging components...
Morning All!
I submitted a question to Altera via their email support center about
x-ray inspection possibly damaging a EPM7256EEFI100-7 device. The device
is a EEPROM made using an advanced CMOS process.
Here is our exchange so far:
>Request No: 10515187 Status: Close-Pending Date Opened (PDT): 9/26/2005
>07:24 AM Date Closed (PDT):
>Inquiry Type: Product Question
>Device Family: Device:
>Title: X-ray inspection of devices
>
>Description: I am doing x-ray inspection of a EPM7256AEFI100-7 device
after board assembly.
>The PCB has a 1.27mm thick copper core in the center of it, so it
>requires
that a high kv x-ray must
>be done in order to see the solder connections of the device. The x-ray
source power is around
>120-130kv. Will this x-ray power level damage the device?
>
>Thank-you,
>
>-Stephen Gregory-
>Process Engineer
>LaBarge Inc.
>
>
------------------------------------------------------------------------
--------------------
>
>Updates 1 - 2 of 2 Add an Update / Previous / Next
>
>Date Created (PDT) 9/27/2005 07:44 PM
>
>To Customer:
>
>Hi Stephen,
>
>Typically assembly uses 90KV using 10 to 20mA with a few second for
inspection of IC package. Our
>recommendation will be a pro-rated 130KV with 7mA to 13mA for a few
second. Note that Prolong exposure
>under X-ray will definitely damage the device. I hope it's helpful to
you.
>
>Best Regards,
>Daniel Cao
My question is; doesn't the figure of 90KV at 10-20mA seem pretty low?
My current Glenbrook RTX-113 operates at 35-52KV at 20-50mA, and
higher-end Glenbrook systems will pump 70-90KV at 90-100mA. Right now,
I'm using a Fein Focus Tiger 160 for x-ray inspection of some copper
cored assemblies that we're building because I have to, that's the only
way we can inspect the BGA's. The copper core in the PCB won't allow
x-ray of the BGA's unless you use a system that can penetrate the core.
But if these devices can be damaged at such a low voltage (if indeed
Daniel's figures are correct), shouldn't Altera issue some sort of
warning to their customers about x-ray damaging the devices? After all,
there will be a lot of customers using x-ray for inspection.
Kind regards,
-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
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