Greetings folks, 
 
The item below is something of likely interest to those not yet aware of it. 
I have seen this demonstrated and it is quite impressive. It looks to be an 
environmental and finacial bright spot in the hazy darkness of the on going 
lead-free fiasco.
 
Best to all, 
Joe 
 
New Dross Elimination Technology Announced
 
September 15, 2005
Los Angeles CA 
 
MS2 Technologies, a P. Kay Metal affiliated company today announced market 
introduction of  a revolutionary new technology to enhance wave and selective 
soldering. The first of the series of products sold under the MS2™ name 
eliminates dross and oxides from the soldering process without the need for nitrogen 
or other exotic gases. The elimination of dross provides a substantial 
reduction in electronic assembly material costs especially with the advent of higher 
priced lead free solders. The world wide patent pending MS2™ process entered 
production testing in the spring of 2005 and will be commercially available in 
November.
 
The first of two products to be made available will be for use with leaded 
solder and the other for all lead free solders including the various SAC alloys. 
The Company will soon identify its distribution partners who will have the 
product fully available at market launch.
 
Larry Kay, President of P. Kay Metal and MS2 Technologies as well as one of 
the inventors of the process stated “The use of MS2™ will reduce solder 
purchases for through-hole assembly by 40-75% depending on production volume. Based 
on published industry estimates that equates to a world wide reduction of 350 
million dollars and with the increasing pressure to go to more expensive lead 
free solder the projected industry savings could approach 1 billion dollars in 
solder purchases annually by 2007. We think that’s significant.” 
 
Dan Feinberg, who is a consultant to the industry and has been involved in 
the development and market introduction of MS2™, stated “When using MS2™ the 
only solder that must be added to the pot is that which is deposited on the 
electronic assembly. We are very excited to be able to bring this needed process 
improvement to an industry hungry for cost reductions and higher manufacturing 
efficiency, especially in light of the impending and expensive global 
conversion to lead free soldering. I have not been this excited about a new product 
launch in 25 years”.
 
For further information contact:
[log in to unmask]
 
Or
Dan Feinberg
[log in to unmask]
(949) 498-7866

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