Sender: |
|
X-To: |
|
Date: |
Fri, 23 Sep 2005 13:11:14 EDT |
Reply-To: |
|
Subject: |
|
MIME-Version: |
1.0 |
Content-Transfer-Encoding: |
quoted-printable |
Content-Type: |
text/plain; charset="UTF-8" |
From: |
|
Parts/Attachments: |
|
|
Greetings folks,
The item below is something of likely interest to those not yet aware of it.
I have seen this demonstrated and it is quite impressive. It looks to be an
environmental and finacial bright spot in the hazy darkness of the on going
lead-free fiasco.
Best to all,
Joe
New Dross Elimination Technology Announced
September 15, 2005
Los Angeles CA
MS2 Technologies, a P. Kay Metal affiliated company today announced market
introduction of a revolutionary new technology to enhance wave and selective
soldering. The first of the series of products sold under the MS2™ name
eliminates dross and oxides from the soldering process without the need for nitrogen
or other exotic gases. The elimination of dross provides a substantial
reduction in electronic assembly material costs especially with the advent of higher
priced lead free solders. The world wide patent pending MS2™ process entered
production testing in the spring of 2005 and will be commercially available in
November.
The first of two products to be made available will be for use with leaded
solder and the other for all lead free solders including the various SAC alloys.
The Company will soon identify its distribution partners who will have the
product fully available at market launch.
Larry Kay, President of P. Kay Metal and MS2 Technologies as well as one of
the inventors of the process stated “The use of MS2™ will reduce solder
purchases for through-hole assembly by 40-75% depending on production volume. Based
on published industry estimates that equates to a world wide reduction of 350
million dollars and with the increasing pressure to go to more expensive lead
free solder the projected industry savings could approach 1 billion dollars in
solder purchases annually by 2007. We think that’s significant.”
Dan Feinberg, who is a consultant to the industry and has been involved in
the development and market introduction of MS2™, stated “When using MS2™ the
only solder that must be added to the pot is that which is deposited on the
electronic assembly. We are very excited to be able to bring this needed process
improvement to an industry hungry for cost reductions and higher manufacturing
efficiency, especially in light of the impending and expensive global
conversion to lead free soldering. I have not been this excited about a new product
launch in 25 years”.
For further information contact:
[log in to unmask]
Or
Dan Feinberg
[log in to unmask]
(949) 498-7866
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|