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August 2005

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Subject:
From:
Peter Swanson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Peter Swanson <[log in to unmask]>
Date:
Tue, 9 Aug 2005 12:51:31 +0100
Content-Type:
text/plain
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Since the demise of 1,1,3-based cleaning systems and a general move to
no-clean processing, I believe that there are few (if any) temporary
masks still commercially available which are removable with defluxing
solvents... unless you include water as a solvent (which it is, of
course!). This process if often done with water soluble temporary
masking materials, of which there are a number available.

Regards, 
Peter 
--
--------------------------------------------------------
Peter Swanson           [log in to unmask]
INTERTRONICS               http://www.intertronics.co.uk
Tel: +44 1865 842842                Oxfordshire, England
INTERTRONICS is dedicated to providing quality material, 
consumable and equipment solutions to the high 
technology, high performance assembly industries, 
incorporating outstanding levels of technical support 
and customer service.

Read our blog! http://www.intertronics.co.uk/blog/blog.htm

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: 08 August 2005 18:24
To: [log in to unmask]
Subject: Re: [TN] Cleaning of gold wirebond pads

Gold pads/fingers can be easily protected & cleaned by applying a
solvent soluble maskant to the parts, then removing when ready with a
suitable  solvent.
See NEPCON West Proceedings, 1981- the details are in a paper by G. J.
Engelland.

Bill  Kenyon
Global Centre Consulting
3336 Birmingham Drive
Fort Collins, CO  80526
Tel: 970.207.9586 Cell: 970.980.6373
email:  [log in to unmask]


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