Hello all,

Could you please assist me to find answer of the questions listed
below.?

1. Why the use of H type flux in the solder paste is not prefered for
Class III equipment production?

2. Any negative impact recorded at IPC since the use of solder paste
with H type flux and so that corrective action taken?

3. What kind of solder paste is acceptable for DoD requirements and
other Class III equipment production?

4. What type of water soluable solder paste prefferable for Class III
applications?

4. Do IPC suggest any specific method to measure the thickness of the
solder paste on the PWB before beginning the process?

 

Regards,

 

Tugmen UNS@L

[log in to unmask]

 

 


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