Hi Judy,
I would assume that you may need a special soldering fixture to protect the
lower melting parts from the higher temps used on the lead free BGA's,
right? Is it a hot air type machine or IR or both? How much does the
Conceptronics machine cost and what are its limitations?
What about having them re-balled with eutectic solder balls like George is
saying? Is that an economical option?
Best regards,
Bill Brooks - KG6VVP
PCB Design Engineer, C.I.D.+, C.I.I.
Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510
Datron World Communications, Inc.
_______________________________________
San Diego Chapter of the IPC Designers Council
Communications Officer, Web Manager
http://dcchapters.ipc.org/SanDiego/
http://pcbwizards.com
-----Original Message-----
From: Judy Brown [mailto:[log in to unmask]]
Sent: Tuesday, August 09, 2005 10:48 AM
To: TechNet E-Mail Forum; Brooks, Bill
Subject: RE: [TN] [DC] Lead-free design changes and impacts?
After the reflow of tin-lead components, we perform a secondary
operation to use the Conceptronics machine to attach the lead-free BGAs
at the higher temperature.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brooks, Bill
Sent: Tuesday, August 09, 2005 10:32 AM
To: [log in to unmask]
Subject: Re: [TN] [DC] Lead-free design changes and impacts?
Ioan,
I will check with Dave Hillman on Technet and forward your comments to
our
Manufacturing Engineers... since we are still planning to be using
eutectic
tin/lead solder for some time we need to be conscious of that issue and
make
sure to get the BGA packages with tin/lead solder balls or we run the
risks
you speak of... Thanks.
I will also notify our purchasing department that they need to watch for
any
changes to BGA packages going lead free...
Perhaps Dave will have more data he can post or send to me to help
inform us
of the potential for failures on BGA lead free packages when soldered
with
Tin/lead solder.
Best regards,
Bill
-----Original Message-----
From: Tempea, Ioan [mailto:[log in to unmask]]
Sent: Tuesday, August 09, 2005 9:46 AM
To: [log in to unmask]
Subject: Re: [DC] Lead-free design changes and impacts?
Yep, big trouble.
Check with Dave Hillman on TN, he very recently wrote a paper showing
what
is happening. You have a good intuition, the 2 alloys will not
completely
mix giving reliability issues of which the most important is cracking at
the
interface with the PCB.
Regards,
Ioan
> -----Original Message-----
> From: DesignerCouncil [SMTP:[log in to unmask]] On Behalf Of
Brooks,Bill
> Sent: Tuesday, August 09, 2005 12:20 PM
> To: [log in to unmask]
> Subject: [DC] Lead-free design changes and impacts?
>
> There is one potential change that I really have not had time to look
into
> yet... maybe someone else has already looked at the BGA packages and
> determined whether or not the 'lead-free' solder balls under the
packages
> will be an issue if you're soldering process does not go
lead-free???...
> Those with RoHS exemptions will still be buying lead-free parts
because
they
> can't get the tin/lead versions anymore, they will be phased out...
Will
> they run into soldering problems if the lead-free solder balls don't
> collapse at eutectic solder melting temps?
>
> Best regards,
>
> Bill Brooks - KG6VVP
> PCB Design Engineer, C.I.D.+, C.I.I.
> Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510
> Datron World Communications, Inc.
> _______________________________________
> San Diego Chapter of the IPC Designers Council
> Communications Officer, Web Manager
> http://dcchapters.ipc.org/SanDiego/
> http://pcbwizards.com
>
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
