Good luck!
We are already having to re-ball a memory part that now comes only in a
lead-free version. It is just not available any other way.
This is necessary because there are problems converting the bare board to
lead-free materials and keep our rather stringent impedance requirements.
Are we having fun yet? :)
--
George Patrick
Tektronix, Inc.
Central Engineering, PCB Design Group
P.O. Box 500, M/S 39-512
Beaverton, OR 97077-0001
Phone: 503-627-5272 Fax: 503-627-5587
http://www.tektronix.com http://www.pcb-designer.com
It's my opinion, not Tektronix'
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brooks,Bill
Sent: Tuesday, August 09, 2005 10:32
To: [log in to unmask]
Subject: Re: [TN] [DC] Lead-free design changes and impacts?
Ioan,
I will check with Dave Hillman on Technet and forward your comments to our
Manufacturing Engineers... since we are still planning to be using eutectic
tin/lead solder for some time we need to be conscious of that issue and make
sure to get the BGA packages with tin/lead solder balls or we run the risks
you speak of... Thanks.
I will also notify our purchasing department that they need to watch for any
changes to BGA packages going lead free...
Perhaps Dave will have more data he can post or send to me to help inform us
of the potential for failures on BGA lead free packages when soldered with
Tin/lead solder.
Best regards,
Bill
-----Original Message-----
From: Tempea, Ioan [mailto:[log in to unmask]]
Sent: Tuesday, August 09, 2005 9:46 AM
To: [log in to unmask]
Subject: Re: [DC] Lead-free design changes and impacts?
Yep, big trouble.
Check with Dave Hillman on TN, he very recently wrote a paper showing what
is happening. You have a good intuition, the 2 alloys will not completely
mix giving reliability issues of which the most important is cracking at the
interface with the PCB.
Regards,
Ioan
> -----Original Message-----
> From: DesignerCouncil [SMTP:[log in to unmask]] On Behalf Of
Brooks,Bill
> Sent: Tuesday, August 09, 2005 12:20 PM
> To: [log in to unmask]
> Subject: [DC] Lead-free design changes and impacts?
>
> There is one potential change that I really have not had time to look into
> yet... maybe someone else has already looked at the BGA packages and
> determined whether or not the 'lead-free' solder balls under the packages
> will be an issue if you're soldering process does not go lead-free???...
> Those with RoHS exemptions will still be buying lead-free parts because
they
> can't get the tin/lead versions anymore, they will be phased out... Will
> they run into soldering problems if the lead-free solder balls don't
> collapse at eutectic solder melting temps?
>
> Best regards,
>
> Bill Brooks - KG6VVP
> PCB Design Engineer, C.I.D.+, C.I.I.
> Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510
> Datron World Communications, Inc.
> _______________________________________
> San Diego Chapter of the IPC Designers Council
> Communications Officer, Web Manager
> http://dcchapters.ipc.org/SanDiego/
> http://pcbwizards.com
>
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