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August 2005

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Subject:
Component standoff vs. ability to clean underneath
From:
Hal Winslow <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Hal Winslow <[log in to unmask]>
Date:
Tue, 9 Aug 2005 09:26:43 -0400
Content-Type:
text/plain
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text/plain (29 lines) 
One of the other manufacturing engineers here remembers seeing some
guidelines relating component body size (basically corner to corner
diagonal measurement) to minimum standoff height to ensure the ability
to clean under the component (using "plain" water).

 

Is this outlined in an IPC document?  We seem to remember seeing the
table or correlation, but of course can't remember where we saw it!

 

Thanks in advance!

 

Hal


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