The article is great reading. However, I did not see any component listing for Ball Grid Array. Does this mean that USC can harm this type of interconnection.
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Wednesday, August 03, 2005 1:23 PM
To: [log in to unmask]
Subject: Re: [TN] Question on cleaning boards with BGA.
You can download the complete paper fro here:
http://www.aqueoustech.com/images/KB/Ultrasonic%20Cleaning%20of%20Military%20PWAs.pdf
John
------------------------------------
Avanex
John Burke
Senior Manager RoHS Compliance
[log in to unmask]
40919 Encyclopedia Circle
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CA 94538
tel: 510 897 4250
fax: 510 979 0189
mobile: 510 676 6312
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Stadem, Richard
Sent: Wednesday, August 03, 2005 11:17 AM
To: [log in to unmask]
Subject: Re: [TN] Question on cleaning boards with BGA.
Found it! http://www.empf.org/library/abstracts/ts0040.html
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Tremmel
Sent: Wednesday, August 03, 2005 9:22 AM
To: [log in to unmask]
Subject: Re: [TN] Question on cleaning boards with BGA.
Hello,
Could you share the URL for the ACI article on US cleaning?
David Tremmel
Technical Manager
Belmont Trading Mexico
Cell - (847) 858-5540
>From: "Stadem, Richard" <[log in to unmask]>
>Reply-To: TechNet E-Mail Forum <[log in to unmask]>, "Stadem,
>Richard" <[log in to unmask]>
>To: [log in to unmask]
>Subject: Re: [TN] Question on cleaning boards with BGA.
>Date: Wed, 3 Aug 2005 09:06:49 -0500
>
>Ramon,
>It is of a different frequency. When I first purchased it, I bought it
>from Crest Ultrasonics in North Dakota. The tech rep was very
>knowledgeable. He told me that it operated at a different frequency
>from the Branson units, and it would not harm (or be less likely to
>harm) the components. I do not recall the frequency, but I am sure they
>can pass that info on. An excellent article was written about this and
>is listed in the American Competitiveness Institute (ACI) archives
>available online. I purchased these Crest units for two companies I
>used to work for, and I was told that they have been working extremely
>well. It has now been 4 years since I purchased the first unit. What
>did you mean by "US cleaning is a noon for PWAs"?
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
>Sent: Wednesday, August 03, 2005 8:34 AM
>To: [log in to unmask]
>Subject: Re: [TN] Question on cleaning boards with BGA.
>
> Hi Richard:
>
> I have known from different sources including this forum that
>US cleaning is a noon for PWAs. I read an article from China that they
>have developed a US cleaning using a different frequency that does not
>damage components of any kind. It seems that your US cleaner might be
>of the frequency that does not damage components.
>
> Regards,
> Ramon
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard
>Sent: Wednesday, August 03, 2005 8:46 AM
>To: [log in to unmask]
>Subject: Re: [TN] Question on cleaning boards with BGA.
>
>I actually have component application info from at least two BGA
>manufacturers that include US cleaning info, and one (Intel) actually
>recommends cleaning with US and a mix of hot de-ionized water mixed
>with a saponifier. So I question the statement that US causes cracked
>solder joints. I do know that it can damage certain components with a
>resonant cavity.
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
>Sent: Wednesday, August 03, 2005 7:39 AM
>To: [log in to unmask]
>Subject: Re: [TN] Question on cleaning boards with BGA.
>
>Hi Paul! What is the physics behind the ultrasonic cleaning system
>causing cracked BGA solder joints? Is your comment based on published
>data or internal data?
>
>Dave Hillman
>Rockwell Collins
>[log in to unmask]
>
>
>
>
> Paul Edwards
> <paul@SURFACE-ART
> .COM>
>To
> Sent by: TechNet [log in to unmask]
> <[log in to unmask]>
>cc
>
>
>Subject
> 08/02/2005 09:41 Re: [TN] Question on cleaning
> PM boards with BGA.
>
>
> Please respond to
> TechNet E-Mail
> Forum
> <[log in to unmask]>
> ; Please respond
> to
> Paul Edwards
> <paul@SURFACE-ART
> .COM>
>
>
>
>
>
>
>Never use an ultrasonic cleaning system with BGAs unless you want to
>generate cracked solder joints...
>
>Assuming your ECN is at the former label location which is why you need
>complete adhesive removal... find out from your label supplier what
>type of adhesive they are using and have them suggest something...
>
>We use an alcohol/glycol/water mix to remove most label adhesives...
>
>Paul Edwards
>Surface Art Engineering
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of David Harman
>Sent: Tuesday, August 02, 2005 4:58 PM
>To: [log in to unmask]
>Subject: [TN] Question on cleaning boards with BGA.
>
> We are remanufacturing (reworking some of product) due to an ECR
>release. We apply a label with non-conductive adhesive that once
>removed leaves adhesive on the PCBA. This adhesive prevents the board
>from passing due to not making contact. The current process requires
>an operator to use IPA and a soft scrub to remove it. This process is
>time consuming. My CM has suggested that we ultrasonic the boards
>using S-10 solvent.
>
>
>
>My boards have BGAs, interconnect pins, and switches along with the
>normal SMT parts. Will using this s-10 solvent in an ultrasonic
>cleaner work, and will it not cause any reliability issues with BGAs or
>other parts on the boards?
>
>
>
>Anyone have any other suggestions for auto cleaning my boards to remove
>the adhesive. We use the no clean process.
>
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