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Subject:	Re: Question on cleaning boards with BGA.
From:	"Blair K. Hogg" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Blair K. Hogg
Date:	Wed, 3 Aug 2005 10:27:13 -0700
Content-Type:	text/plain
Parts/Attachments:	text/plain (35 lines)

Hot cracked solder joints, but I have seen US cleaning damage components. Back in the late 80's a component manufacturer that my employer at that time was using was manufacturing a component with preformed leads soldered on a ceramic (thick film, I presume) substrate. The device was US cleaned after the leads were soldered. The US cleaning caused fractures in the leads where they were formed at the component end. Eliminating US cleaning corrected the problem.

Not sure if US in use today would have the same affect.

Blair

>>> [log in to unmask] 08/03/05 08:34AM >>>
I have never heard of US cleaning causing cracked solder joints. I have
used US for thousands of assemblies with BGAs, flipchips and uBGA and
CSP components, and have never had any such thing happen. Perhaps I was
lucky. Do you have any documentation to support that general statement?

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