TECHNET Archives

August 2005

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bev Christian <[log in to unmask]>
Date:
Wed, 31 Aug 2005 15:52:42 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (119 lines)
George,
The pads are as flat and smooth as a baby's bottom - and gray.
Bev
RIM

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wenger, George M.
Sent: August 31, 2005 3:47 PM
To: [log in to unmask]
Subject: Re: [TN] Exposed nickel and rework

Bev,

What kind of cracked solder joints on ENIG boards?  Are the solder
joints fractured and you see mostly exposed Ni with small islands of
solder stuck to the pads or do the pads show mostly cohesive failures in
the solder with small islands or areas of exposed Ni?  The majority of
what we do is on IAg boards but every now and then we do come across an
ENIG board.  When we need to replace a component, especially a BGA, our
recommendation is not to use solder wick but to pretin the pads with
solder to insure they are solderable and then use a solder sucker to
clean off the excess solder, so we can use a micro-stencil to print
fresh solder paste, place the component and either run it through a
reflow oven if the other components can be reflowed again or use a BGA
repair process.  


Regards,
George
George M. Wenger
Reliability / FMA Engineer
Base Station and Subsystems Group
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059 (908) 546-4531
[log in to unmask]

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bev Christian
Sent: Wednesday, August 31, 2005 11:17 AM
To: [log in to unmask]
Subject: [TN] Exposed nickel and rework

TechNetters,
Are any of you willing to say what you company has for a policy about
reworking returns from the field, where there are cracked solder joints
on ENIG boards where, when the component is removed, there is exposed
nickel or exposed intermetallic, rather than solder?  Thanks in advance.
Bev
RIM



---------------------------------------------------------------------
This transmission (including any attachments) may contain confidential
information, privileged material (including material protected by the
solicitor-client or other applicable privileges), or constitute
non-public information. Any use of this information by anyone other than
the intended recipient is prohibited. If you have received this
transmission in error, please immediately reply to the sender and delete
this information from your system. Use, dissemination, distribution, or
reproduction of this transmission by unintended recipients is not
authorized and may be unlawful.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
(re-start) delivery of Technet send e-mail to [log in to unmask]: SET
Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
archives of previous posts at: http://listserv.ipc.org/archives Please
visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

------------------------------------------------------------------------
------------------------
This message is for the designated recipient only and may
contain privileged, proprietary, or otherwise private information.  
If you have received it in error, please notify the sender
immediately and delete the original.  Any unauthorized use of
this email is prohibited.
------------------------------------------------------------------------
------------------------
[mf2]

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------




---------------------------------------------------------------------
This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. Any use of this information by anyone other than the intended recipient is prohibited. If you have received this transmission in error, please immediately reply to the sender and delete this information from your system. Use, dissemination, distribution, or reproduction of this transmission by unintended recipients is not authorized and may be unlawful.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2