Hi all,
By the way, I am looking after storage cabinete with shelves, overpressured
nitrogen as alternative for vacuum storage for moisture sensitive polyimide
innerlayers. Any ideas ???
Edward
> -----Original Message-----
> From: Stadem, Richard [SMTP:[log in to unmask]]
> Sent: в аевеси 30 2005 15:05
> To: [log in to unmask]
> Subject: Re: [TN] ENIG/ Immersion Gold Plating and Pre-baking &
> Solderability
>
> Baking of ENIG plated boards may be a requirement in order to drive out
> moisture even though it can exacerbate a nickel oxide formation that is
> already started. But there are other options for moisture removal,
> including lower bake temperatures at longer times. You could even lease
> a precision scale and see at what length of time is required for simply
> putting the PWB into a drybox (a dessicator box such as McDry, not a
> nitrogen box) and allowing it to dry at room temperature for a period
> long enough to reduce the moisture content by 90% or more. J-STD-030
> does state that the bake times and temperatures they list for components
> and pwbs are guidelines. If you can prove your bake process or
> dessication process is removing the moisture, then you are qualifying a
> lower temp and longer time. You will need to use a number of pwbs in
> order to do this, as there is some variation in weights caused by resin
> content, etc. But you should be able to show a reduction in the average
> of weights (mean weight).
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Chris Schaefer
> Sent: Friday, August 26, 2005 10:10 AM
> To: [log in to unmask]
> Subject: [TN] ENIG/ Immersion Gold Plating and Pre-baking &
> Solderability
>
> Hello Everyone,
>
> Feels great today because IT'S Friday - so all is good!
>
> Questions:
>
> Does baking these types of plating affect solderability? If so what
> factors play a part (i.e. baking temperature, plating thickness, baking
> time, etc...). I know that if baked it can cause the Nickel Oxide layer
> to become less solderable if the plating process is Poor (thanks Richard
> S.). Is there is a factual study that proves that baking any type of
> gold plated boards in any way shape or form reduces the solderability
> and/ or reliablity of the joints/ product? I am trying to gather data to
> prove to management that baking is a bad decision with this type of
> plating and should never be performed. Also if a Gold Plated board of
> any type is suspect for high level moisture content - how do you remove
> the moisture "IF" baking is not acceptable?
>
> As always I appreciate your help. If anyone has specific examples or
> studies to prove or dis-prove this I would appreciate copies if
> available.
>
> Chris Schaefer
> Suntron Corporation
> Process Engineer
> 540 N. Rogers Road
> Olathe, Kansas 66062
> 913.393.5878
> [log in to unmask]
>
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