Now this is a blast from the past topic! I worked for Dynachem when we
brought out equipment and photoresist for applying dry film photoresist with
a small bead of water to solubilize the resist and flow into the surface
features of the copper foil. This was back in the early 90s and at that
time, it was not a new idea. I do not know if any equipment manufacturers
still make the systems or if any of the old systems are still available. I
do have a copy of the manual we put together at the time! That was with Dr.
Leo Roos, Elmer Hayes, and the equipment group at Dynachem.
The problems experienced were: not all photoresists were compatible with wet
lamination - some resists tended to "lock into" the copper and were
difficult to develop and strip after wet lamination, controlling the amount
of water at the interface of the resist and panel was critical for process
consistency, water quality was a factor, and how the water was applied and
where it ended up, ie, on top of the mylar, affected subsequent processing.
We found at the time, that using wet lamination was most beneficial in large
inner layer operations where the process ran continuously and reached a sort
of equilibrium. And obviously, the technique is greatly applicable to inner
layers and not so applicable to outer layers with drilled holes. Although,
I wonder how it would work with some of today's buried via layers?
That was all back in the good old days. I do not know if equipment is still
available or photoresists formulated for compatibility with wet lamination.
Good luck in your search.
Jana Carraway
Jana Carraway
MSEI - Advanced Technology Group
6024 S.W. Jean Road
Lake Oswego, OR 97035
503.697.5291, ext 1180
email: [log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Baski Devre
Sent: Monday, August 29, 2005 7:09 AM
To: [log in to unmask]
Subject: [TN] Wet Lamination
Dear Technetters
I read an articel on wet lamination so below is the quatation from the
article
"Wet lamination of dry film photoresist is not new, but is growing
significantly in popularity as cost and technology demands are increasing.
Wet lamination helps reduce defects attributed to poor dry film
conformation. Key to success for wet lamination has been the reliabilty of
the equipment, the wetting station that is attached to the dry film
laminator. There are currently about 120 installed wet lamination units in
operation which confirms that this process is dependable. the wet lamination
process has demonstrated significantly improved yields through a reduction
in condutor opens/nicks."
I have elaborated on the article "dry Film Photoresist Technology
for
Profitable Western PCB Production"
First of all thank you for that you issued such a half technical and half
economical article. We are PCB manufacturer and we apply dry film panel
palting and as you mentioned in your article wet lamination will avoid some
nicks and opens defects. So How we can apply these wet lamination to our
process. What we need to do what do you advice us to do. Can you please
provide us with technical assistance for this.
We are waiting for your kind interpretation and knowledge
So is there anybody who has knowledge about wet lamination process and what
kind of equipments we need to convert our process to wet lamination
process.?
Best Regards
Yusuf GÖMEÇ
Product Quality Engineer
BASKI DEVRE SAN ve TIC LTD STI
Ceyhan Sk. No:10 34896 Pendik-Istanbul-Turkey
Tel: 00 90 216 3901036 (4 Hat/Line)-173(Extention)
00 90 216 4836560 (4 Hat/Line)-173(Extention)
Fax: 00 90 216 3544941
00 90 216 4913269
Gsm: 00 90 533 6579897
00 90 533 7480014
Internet: www.baskidevre.com.tr
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