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August 2005

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Subject:
From:
Baski Devre <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Baski Devre <[log in to unmask]>
Date:
Mon, 29 Aug 2005 17:08:57 +0300
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Dear Technetters

I read an articel on wet lamination so below is the quatation from the
article
        "Wet lamination of dry film photoresist is not new, but is growing
significantly in popularity as cost and technology demands are increasing.
Wet lamination helps reduce defects attributed to poor dry film
conformation. Key to success for wet lamination has been the reliabilty of
the equipment, the wetting station that is attached to the dry film
laminator. There are currently about 120 installed wet lamination units in
operation which confirms that this process is dependable. the wet lamination
process has demonstrated significantly improved yields through a reduction
in condutor opens/nicks."
        I have elaborated on the article "dry Film Photoresist Technology for
Profitable Western PCB Production"
First of all thank you for that you issued such a half technical and half
economical article. We are PCB manufacturer and we apply dry film panel
palting and as you mentioned in your article wet lamination will avoid some
nicks and opens defects. So How we can apply these wet lamination to our
process. What we need to do what do you advice us to do. Can you please
provide us with technical assistance for this.

We are waiting for your kind interpretation and knowledge
So is there anybody who has knowledge about wet lamination process and what
kind of equipments we need to convert our process to wet lamination
process.?
Best Regards




Yusuf GÖMEÇ
Product Quality Engineer

BASKI DEVRE SAN ve TIC LTD STI
Ceyhan Sk. No:10 34896 Pendik-Istanbul-Turkey

Tel: 00 90 216 3901036 (4 Hat/Line)-173(Extention)
     00 90 216 4836560 (4 Hat/Line)-173(Extention)
Fax: 00 90 216 3544941
     00 90 216 4913269
Gsm: 00 90 533 6579897
     00 90 533 7480014

Internet: www.baskidevre.com.tr

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