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August 2005

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Subject:
Re: IPC-6012B Class 3A Questions
From:
Franklin Asbell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Franklin Asbell <[log in to unmask]>
Date:
Fri, 26 Aug 2005 11:30:58 -0500
Content-Type:
text/plain
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text/plain (80 lines) 
What I read into that are;

1.      It does not. Negative Etchback "exceeding" the requirements of
Figure 3-9 are not acceptable.

2.      Of course vias may be plugged, would you want to however, plug
through holes? What that table is expressing is that the via hole (hole
wall, interface, quality, thickness, etc) requirements are the same for
through hole regardless of what may fill them (solder, ceramic, conductive
silver, component leads, etc).

Franklin



-----Original Message-----
From: schaefer, dave [mailto:[log in to unmask]]
Sent: Friday, August 26, 2005 10:30 AM
To: [log in to unmask]
Subject: [TN] IPC-6012B Class 3A Questions

I have a few questions regarding the requirements of IPC-6012B
classification "3A" (ref. "IPC-6012B Performance Specification Sheet for
Space and Military Avionics"):

- Why does the Performance Sheet define NEGATIVE ETCHBACK (3.6.2.8) as being
unacceptable?

- The description of "Through Via Plugging" requires clarification - is the
Performance Sheet indicating that Vias and Through Holes cannot be plugged?
If so, why?

Thanks,

Dave Schaefer

Bristol Aerospace

(204)775-8331 ext 3186





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