Hello Everyone,

Feels great today because IT'S Friday - so all is good!

Questions:

Does baking these types of plating affect solderability? If so what factors
play a part (i.e. baking temperature, plating thickness, baking time,
etc...). I know that if baked it can cause the Nickel Oxide layer to become
less solderable if the plating process is Poor (thanks Richard S.). Is
there is a factual study that proves that baking any type of gold plated
boards in any way shape or form reduces the solderability and/ or
reliablity of the joints/ product? I am trying to gather data to prove to
management that baking is a bad decision with this type of plating and
should never be performed. Also if a Gold Plated board of any type is
suspect for high level moisture content - how do you remove the
moisture "IF" baking is not acceptable?

As always I appreciate your help. If anyone has specific examples or
studies to prove or dis-prove this I would appreciate copies if available.

Chris Schaefer
Suntron Corporation
Process Engineer
540 N. Rogers Road
Olathe, Kansas 66062
913.393.5878
[log in to unmask]

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